More than an energy efficient profile, it is understanding the importance of comfort in every room.
HITEP is our new thermal break profile with 37% improved transmittance, but without changing the design of the aluminium profiles.
With a thermal transmittance coefficient of just 0.19 W/(m.K), thanks to HITEP you will be able to improve the energy efficiency of your aluminium system, thus obtaining a more competitive product without affecting its design.
Our technical office conducts studies to recommend proposals and solutions that allow you to achieve the best thermal transmittance coefficients for your system.
We create custom designs for your system, giving you an exclusive solution that adds value to your product on the market.
We have ATG technical approval, the highest level of recognition in the manufacture of thermal break polyamide profiles.
Besides our polyamide profiles, we offer polyamide foam or polyethylene with a thermal conductivity of just 0.036 W/(m.K).
These foams have an adhesive film on their inner side, so that you don’t have to worry about this process.
Polyamide foam is suitable for both coating and anodising.
Glue wire forms a very powerful bond between the polyamide profile and the aluminium profile when coating is performed subsequently.
This is due to the fact that, during the paint curing process, polyamide profiles suffer a small loss of volume, with the possibility of a loss of shear tightness of the polyamide profiles.
We can prevent this from happening thanks to glue wire, which fills and fuses the two materials.
Sometimes it is necessary to maintain the black colour of polyamide after coating in the case of untreated profiles.
If this is the case, it is not a problem thanks to the possibility of adding an adhesive film that can withstand high temperatures and that is removed after the coating process.
This technique is called Masking and, if you require further information, please contact us.
